Superfill CVD

Metallization for current and beyond 100nm

Copper is the way for interconnection and there is a dry way for copper deposition. Superfill CVD can fill holes and trenches swiftly without voids or defects, of which flat top surface and thin film on field area makes CMP easy.

Figure 1. SEM images show the evolution of Cu film deposited on a trench by Superfill CVD.

Figure 2. SEM image shows flat top surface after Superfill CVD of Cu on repeating hole pattern.

Figure 3. Crosssectional SEM image of a hole half-filled by Superfill CVD.