UNPLA CMP

Genitech's CMP technology is licensed to Semicontech Corporation.

The patterns on ever shrinking semiconductor chips are now as fine as 0.18 micrometer and will go finer. Completely flat surfaces are needed to form such find patterns by lithography. Chemical mechanical planarization (CMP) is used to prepare flat surfaces on wafer. Genitech's unique mechanism, for which patents are pending, provides ideal motion of a polishing pad relative to a wafer. To every point of wafer surface, the pad appears to move in the same way with the same velocity in every direction. Also the displacement of wafer and pad is not large and the motion is mechanically stable.

Advantages

• Excellent uniformity
• Superior mechanical stability
• Small foot-print

Applications

• Oxide planarization
• Metal planarization
• Wafer reclaiming